Active control of die-level temperature is required during production testing of high power microprocessors in order to ensure accurate performance classification, but control is becoming more difficult as the device power densities increase. With power densities approaching 100W/cm2, the current passive control systems are no longer able to maintain the required temperature tolerance for production testing. This paper describes the design and testing of a temperature control system that combines high performance impingement cooling with higher power laser heating with application to packaged integrated circuit devices under dynamic testing conditions. Also presented are system design concepts and experimental results for typical microprocessor thermal test vehicles.

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