As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a metal-oxide-semiconductor field-effect transistor on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique using Fourier analysis techniques for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.

Issue Section:
Technical Briefs
Keywords:
heat sinks, MOSFET, thermal management (packaging)
Topics:
Heat sinks, Water, Poles (Building), Microchannels
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 by American Society of Mechanical Engineers
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