Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) direct analogy and (2) normalized analogy. The schemes are implemented to define valid domains of application. The results corroborate that the direct analogy is valid only for single-material systems, but the normalized analogy can be extended to multimaterial systems if thermal loading conditions are isothermal, spatially as well as temporally.

1.
Pecht
,
M.
, 1999, “
Moisture Sensitivity Characterization of Build-up Ball Grid Array Substrates
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part B
1070-9894,
22
, pp.
515
523
.
2.
Ferguson
,
T.
, and
Qu
,
J.
, 2002, “
Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface
,”
ASME J. Electron. Packag.
1043-7398,
124
, pp.
106
110
.
3.
Stellrecht
,
E.
,
Han
,
B.
, and
Pecht
,
M.
, 2004, “
Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages
,”
IEEE Trans. Compon. Packag. Technol.
1521-3331,
27
, pp.
499
506
.
4.
Galloway
,
J. E.
, and
Miles
,
B. M.
, 1997, “
Moisture Absorption and Desorption Predictions for Plastic Ball Grid Array Packages
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
1070-9886,
20
, pp.
274
279
.
5.
Puig
,
O.
,
Martinot
,
C.
, and
Roustan
,
P.
, 1998, “
Moisture Ingress and Absorption in a CCD Package Characterisation, Modelisation and Measurement
,”
Proceedings of the POLY’ 98
,
France
, pp.
1
7
.
6.
Wong
,
E. H.
,
Teo
,
Y. C.
, and
Lim
,
T. B.
, 1998, “
Moisture Diffusion and Vapor Pressure Modeling of IC Packaging
,”
Proceedings of the 48th Electronic Components and Technology Conference
, pp.
1372
1378
.
7.
Wong
,
E. H.
,
Chan
,
K. C.
,
Tee
,
T. Y.
, and
Rajoo
,
R.
, 1999, “
Comprehensive Treatment of Moisture Induced Failure in IC Packaging
,”
Proceedings of the third Electronics Manufacturing Technology Conference
,
Japan
, pp.
176
181
.
8.
Wong
,
E. H.
,
Rajoo
,
R.
,
Koh
,
S. W.
, and
Lim
,
T. B.
, 2002, “
The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging
,”
ASME J. Electron. Packag.
1043-7398,
124
, pp.
122
126
.
9.
Wong
,
E. H.
,
Koh
,
S. W.
,
Lee
,
K. H.
, and
Rajoo
,
R.
, 2002, “
Comprehensive Treatment of Moisture Induced Failure—Recent Advances
,”
IEEE Trans. Electron. Packag. Manuf.
1521-334X,
25
, pp.
223
230
.
10.
Wong
,
E. H.
,
Koh
,
S. W.
,
Lee
,
K. H.
, and
Rajoo
,
R.
, 2002, “
Advanced Moisture Diffusion Modeling and Characterization for Electronic Packaging
,”
Proceedings of the 52nd Electronic Components and Technology Conference
, pp.
1297
1303
.
11.
Wong
,
E. H.
,
Koh
,
S. W.
,
Lee
,
K. H.
, and
Lim
,
K. M.
, 2002, “
Advances in Vapor Pressure Modeling for Electronic Packaging
,”
Proceedings of the Third Eurosime Conference
, pp.
347
355
.
12.
Yi
,
S.
,
Goh
,
J. S.
, and
Yang
,
J. C.
, 1995, “
Finite Element Analysis of Hygrothermally Induced Stresses in Plastic IC Packages
,”
Proceedings of the 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits
, pp.
32
39
.
13.
Tee
,
T. Y.
,
Fan
,
X. J.
, and
Lim
,
T. B.
, 1999, “
Modeling of Whole Field Vapor Pressure During Reflow for Flip Chip BGA and Wire Bond PBGA Packages
,”
Proceedings of the First Electronics Material Packaging Workshop
,
Singapore
, pp.
38
45
.
14.
Lam
,
T. F.
, 2000, “
FEA Simulation on Moisture Absorption in PBGA Packages Under Various Moisture Pre-Conditioning
,”
Proceedings of the 50th Electronic Components and Technology Conference
, pp.
1078
1082
.
15.
Shook
,
R. L.
,
Gerlach
,
D. L.
, and
Vaccaro
,
B. T.
, 2001, “
Moisture Blocking Planes and Their Effect on Reflow Performance in Achieving Reliable Pb-Free Assembly Capability for PBGAs
,”
Proceedings of the 52nd Electronic Components and Technology Conference
, pp.
74
79
.
16.
Dudek
,
R.
,
Walter
,
H.
, and
Michel
,
B.
, 2002, “
Studies on Moisture Diffusion and Popcorn Cracking
,”
Proceedings of the 52nd Electronic Components and Technology Conference
, pp.
225
232
.
17.
Vaddadi
,
P.
,
Nakamura
,
T.
, and
Singh
,
R. P.
, 2003, “
Inverse Analysis for Transient Moisture Diffusion Through Fiber-Reinforced Composites
,”
Acta Mater.
1359-6454,
51
, pp.
177
193
.
18.
Tee
,
T. Y.
, and
Zhong
,
Z.
, 2004, “
Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of QFN Package During Reflow With Interfacial Fracture Mechanics Analysis
,”
Microelectron. Reliab.
0026-2714,
44
, pp.
105
114
.
19.
Chang
,
K. C.
,
Yeh
,
M. K.
, and
Chiang
,
K. N.
, 2004, “
Hygrothermal Stress Analysis of a Plastic Ball Grid Array Package During Solder Reflow
,”
Proc. Inst. Mech. Eng., Part C: J. Mech. Eng. Sci.
0954-4062,
218
, pp.
957
970
.
20.
Wu
,
B.
,
Yang
,
W.
, and
Jia
,
C.
, 2004, “
A Three-Dimensional Numerical Simulation of Transient Heat and Mass Transfer inside a Single Rice Kernel During the Drying Process
,”
Biosyst. Eng.
1537-5110,
87
, pp.
191
200
.
21.
Chen
,
X.
,
Zhao
,
S.
, and
Zhai
,
L.
, 2005, “
Moisture Absorption and Diffusion Characterization of Molding Compound
,”
ASME J. Electron. Packag.
1043-7398,
127
, pp.
460
465
.
22.
Welty
,
J. R.
,
Wicks
,
C. E.
,
Wilson
,
R. E.
, and
Rorrer
,
G. L.
, 2000,
Fundamentals of momentum, heat and mass transfer
,
4th ed.
,
Wiley
,
New York
.
23.
Lykov
,
A. V.
, and
Mikhailov
,
Y. A.
, 1965,
Theory of Heat and Mass Transfer
, I. Shechtman, trans., Israel Program for Scientific Translations, Jerusalem.
24.
Jost
,
W.
, 1960,
Diffusion in Solids, Liquids, Gases
,
3rd ed.
,
Academic
,
New York
.
25.
Crank
,
J.
, 1975,
The Mathematics of Diffusion
,
2nd ed.
,
Oxford University Press
,
UK
.
26.
Vieth
,
W. R.
, 1991,
Diffusion in and Through Polymers: Principles and Applications
,
Hanser
,
Munich
.
27.
Uschitsky
,
M.
, and
Suhir
,
E.
, 2001, “
Moisture Diffusion in Epoxy Molding Compounds Filled With Particles
,”
ASME J. Electron. Packag.
1043-7398,
123
, pp.
47
51
.
28.
Jang
,
C.
,
Han
,
S.
,
Kim
,
Y.
,
Kim
,
H.
,
Yoon
,
S.
,
Cho
,
S.
,
Han
,
C.
, and
Han
,
B.
, 2005, “
Development of Predictive Modeling Scheme for Flip-Chip on Fine Pitch Flex Substrate
,”
Proceedings of the Sixth International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005)
, pp.
566
574
.
29.
Vogels
,
R. C. J.
,
Huang
,
M.
,
Yang
,
D. G.
,
van Driel
,
W. D.
, and
Zhang
,
G. Q.
, 2005, “
Fast Characterization for Moisture Properties of Moulding Compounds: Influence of Temperature and Humidity
,”
Sixth International Conference on Electronic Packaging Technology
, pp.
185
190
.
30.
ABAQUS 6.4, Analysis User’s Manual, Sec. 6.8.1.
31.
Carslaw
,
H. S.
, and
Jaeger
,
J. C.
, 1959,
Conduction of Heat in Solids
,
2nd ed.
,
Oxford University Press
,
London
.
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