The design of cooling systems for electronic equipment is getting more involved and challenging due to increase in demand for faster and more reliable electronic systems. Therefore, robust and more efficient design and optimization methodologies are required. Conventional approaches are based on sequential use of numerical simulation and experiment. Thus, they fail to use certain advantages of using both tools concurrently. The present study is aimed at combining simulation and experiment in a concurrent manner such that outputs of each approach drive the other to achieve better engineering design in a more efficient way. In this study, a relatively simple problem, involving heat transfer from multiple heat sources simulating electronic components and located in a horizontal channel, was investigated. Two experimental setups were fabricated for air and liquid cooling experiments to study the effects of different coolants. De-ionized water was used as the liquid coolant in one case and air in the other. The effects of separation distance and flow conditions on the heat transfer and on the fluid flow characteristics were investigated in detail for both coolants. Cooling capabilities of different cooling arrangements were compared and the results from simulations and experiments were combined to create response surfaces and to find the optimal values of the design parameters.
Skip Nav Destination
Article navigation
December 2006
Research Papers
Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment
Tunc Icoz,
Tunc Icoz
Thermal Scientist
GE Global Research
, One Research Circle, Niskayuna NY 12309
Search for other works by this author on:
Nitin Verma,
Nitin Verma
Graduate Assistant
Rutgers University
, Dept. Mechanical & Aerospace Eng., New Brunswick, NJ 08901, USA
Search for other works by this author on:
Yogesh Jaluria
Yogesh Jaluria
Board of Governors Professor
Fellow, ASME
Rutgers University
, Dept. Mechanical & Aerospace Eng., New Brunswick, NJ 08901
Search for other works by this author on:
Tunc Icoz
Thermal Scientist
GE Global Research
, One Research Circle, Niskayuna NY 12309
Nitin Verma
Graduate Assistant
Rutgers University
, Dept. Mechanical & Aerospace Eng., New Brunswick, NJ 08901, USA
Yogesh Jaluria
Board of Governors Professor
Fellow, ASME
Rutgers University
, Dept. Mechanical & Aerospace Eng., New Brunswick, NJ 08901J. Electron. Packag. Dec 2006, 128(4): 466-478 (13 pages)
Published Online: March 27, 2006
Article history
Received:
January 9, 2006
Revised:
March 27, 2006
Citation
Icoz, T., Verma, N., and Jaluria, Y. (March 27, 2006). "Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment." ASME. J. Electron. Packag. December 2006; 128(4): 466–478. https://doi.org/10.1115/1.2353284
Download citation file:
Get Email Alerts
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Related Articles
Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling
J. Thermal Sci. Eng. Appl (June,2011)
Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs
J. Electron. Packag (December,2004)
Numerical Study of Aerodynamic Losses of Effusion Cooling Holes in Aero-Engine Combustor Liners
J. Eng. Gas Turbines Power (February,2011)
Performance of an Absorber With Hydrophobic Membrane Contactor at Aqueous Solution-Water Vapor Interface
J. Thermal Sci. Eng. Appl (September,2010)
Related Proceedings Papers
Related Chapters
Thermoelectric Coolers
Thermal Management of Microelectronic Equipment
Adding Surface While Minimizing Downtime
Heat Exchanger Engineering Techniques
Tempera-Mental Prototypes
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong