An analytical model is developed for natural convection from a single circuit board in a sealed electronic equipment enclosure. The circuit card is modeled as a vertical isothermal plate located at the center of an isothermal, cuboid shaped enclosure. A composite model is developed based on asymptotic solutions for three limiting cases: pure conduction, laminar boundary layer convection, and transition flow convection. The conduction shape factor and natural convection models are validated using data from CFD simulations for a wide range of enclosure geometries and flow conditions. The model is shown to be in good agreement, to within 10% RMS, with the numerical data for all test configurations.

1.
Park
,
S. K.
, 1999, “
Natural Convection Air Cooling between Vertical Parallel Plates with Heated Protrusions Simulating Plate-Mounted Electronic Components within an Enclosure
,”
Adv. Electron. Packag.
EEP, Vol.
26-1
, pp.
501
509
.
2.
Tang
,
L.
, and
Joshi
,
Y. K.
, 1999, “
Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure
,”
ASME J. Electron. Packag.
1043-7398,
121
, pp.
108
115
.
3.
Symons
,
J. G.
,
Mahoney
,
K. J.
, and
Bostock
,
T. C.
, 1987, “
Natural Convection in Enclosures with Through-Flow Heat Sources
,” Proceedings of the 1987 ASME/JSME Thermal Engineering Joint Conference, Vol.
2
, pp.
215
220
.
4.
Yang
,
M.
, and
Tao
,
W. Q.
, 1995, “
Three-Dimensional Natural Convection in an Enclosure with an Internal Isolated Vertical Plate
,”
ASME J. Heat Transfer
0022-1481,
117
, pp.
619
625
.
5.
Teertstra
,
P. M.
, 2003, “
Models and Experiments for Laminar Natural Convection from Heated Bodies in Enclosures
,” Ph.D. thesis, Department of Mechanical Engineering, University of Waterloo, Waterloo, Ontario, Canada.
6.
Teertstra
,
P. M.
,
Yovanovich
,
M. M.
, and
Culham
,
J. R.
, 2004, “
Analytical Modelling of Natural Convection in Concentric Spherical Enclosures
,” AIAA-2004-0496, 42nd Aerospace Sciences Meeting and Exhibit Conference, Reno, NV, 5–7 Jan.
7.
Churchill
,
S. W.
, and
Usagi
,
R.
, 1972, “
A General Expression for the Correlation of Rates of Transfer and Other Phenomenon
,”
AIChE J.
0001-1541,
18
, pp.
1121
1128
.
8.
Yovanovich
,
M. M.
, 1998, “
Conduction and Thermal Contact Resistances (Conductances)
,”
Handbook of Heat Transfer
,
3rd. ed.
, edited by
W. M.
Rohsenow
,
J. P.
Harnett
, and
Y.
Cho
,
McGraw-Hill
, New York, Chap. 3, pp.
3.1
3.73
.
9.
Churchill
,
S. W.
, and
Churchill
,
R. U.
, 1975, “
A Comprehensive Correlating Equation for Heat and Component Heat Transfer by Free Convection
,”
AIChE J.
0001-1541,
21
, pp.
604
606
.
10.
Lee
,
S.
,
Yovanovich
,
M. M.
, and
Jafarpur
,
K.
, 1991, “
Effects of Geometry and Orientation on Laminar Natural Convection Heat Transfer from Isothermal Bodies
,”
J. Thermophys. Heat Transfer
0887-8722,
5
, pp.
208
216
.
11.
Jafarpur
,
K.
, and
Yovanovich
,
M. M.
, 1993, “
Models of Laminar Natural Convection from Vertical and Horizontal Isothermal Cuboids for all Prandtl Numbers and all Rayleigh Numbers below 1011
,” ASME Winter Annual Meeting, HTD-Vol.
264
, pp.
111
126
.
12.
Batchelor
,
G. K.
, 1954, “
Heat Transfer by Free Convection Across a Closed Cavity Between Vertical Boundaries at Different Temperatures
,”
Q. Appl. Math.
0033-569X,
12
, pp.
209
223
.
13.
Flomerics Inc.
, 2004, 257 Turnpike Rd. Suite 100, Southborough, MA.
14.
Fluent Inc.
, 2004, 10 Cavendish Court, Lebanon, NH.
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