This study is motivated by the urgent need in the electronics industry for mechanical properties and durability of Pb-free solders because the use of Pb will be banned in the EU by July 1, 2006. The isothermal mechanical durability of three NEMI recommended Pb-free solders, 95.5Sn-3.9Ag-0.6Cu, 96.5Sn-3.5Ag, and 99.3Sn-0.7Cu, is tested on the thermo-mechanical-microscale (TMM) setup under two test conditions: room temperature and relatively high strain rate, and high temperature and low strain rate. The test data are presented in a power law relationship between three selected damage metrics (total strain range, inelastic strain range, and cyclic work density) to 50% load drop. The obtained mechanical durability models of three Pb-free solders are compared with those of the eutectic 63Sn-37Pb solder at the two selected test conditions and at the same homologous temperature of 0.75. The results of this study can be used for virtual qualification of Pb-free electronics during design and development of electronics under mechanical loading.
Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu
Zhang, Q., Dasgupta, A., and Haswell, P. (May 3, 2005). "Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu." ASME. J. Electron. Packag. December 2005; 127(4): 512–522. https://doi.org/10.1115/1.2056569
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