A systematic multidisciplinary electronics packaging design and optimization methodology, which takes into account the complexity of multiple design trade-offs, operated in conjunction with the artificial neural networks (ANNs) technique is presented. To demonstrate its capability, this method is applied to a plastic ball grid array package design. Multidisciplinary criteria including thermal, structural, electromagnetic leakage, and cost are optimized simultaneously using key design parameters as variables. A simplified routability criterion is also considered as a constraint. ANNs are used for thermal and structural performance predictions which resulted in large reduction in computational time. The present methodology is able to provide the designers a tool for systematic evaluation of the design trade-offs which are represented in the objective function. This methodology can be applied to any electronic product design at any packaging level from the system level to the chip level.
A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks
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Hadim, H., and Suwa, T. (November 16, 2004). "A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks." ASME. J. Electron. Packag. September 2005; 127(3): 306–313. https://doi.org/10.1115/1.1997161
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