Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions Available to Purchase

To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with $63Sn∕37Pb$ and $Sn∕3.5Ag∕0.75Cu$ solder joints in room temperature. The mechanical low cycle fatigue tests were performed under several loading angles. The loading angle is controlled by several grips which have specific surface angle to the loading direction. Constant displacement controlled tests are performed using a micro-mechanical test apparatus. It was found that the normal deformation significantly affects the fatigue life of the solder joint. Throughout the whole test conditions at room temperature, $Sn∕3.5Ag∕0.75Cu$ solder alloy had longer fatigue life than $63Sn∕37Pb$ alloy. Failure patterns of the fatigue tests were observed and discussed. A morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints under mixed mode loading condition.