The paper presents a study of creep behavior of a printed wiring board caused by the mechanical fastening of separable connector, known as a land grid array. Time-temperature superposition method was employed to predict the lifetime creep behavior. A low-cost testing method based on the ASTM D790 three-point bending procedure was developed to predict and characterize creep of polymeric materials under low temperature, low stress, and large elapsed times.

Issue Section:
Research Papers
Keywords:
creep testing, printed circuits, integrated circuit packaging, printed circuit testing, polymers
Topics:
Creep, Printed circuit boards, Temperature, Testing
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Copyright © 2005
 by American Society of Mechanical Engineers
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