The design and thermal performance of a synthetic-air-jet-based heat sink for high-power dissipation electronics is discussed. Each fin of a plate-fin heat sink is straddled by a pair of two-dimensional synthetic jets, thereby creating a jet ejector system that entrains cool ambient air upstream of the heat sink and discharges it into the channels between the fins. The jets are created by periodic pressure variations induced in a plenum by electromagnetic actuators. The performance of the heat sink is assessed using a thermal test die encased in a heat spreader that is instrumented with a thermocouple. The case-to-ambient thermal resistance under natural convection with the heat sink is . Forced convection with the synthetic jets enables a power dissipation of at a case temperature of , resulting in a case-to-ambient thermal resistance of . The synthetic-jet heat sink dissipates more heat compared to steady flow from a ducted fan blowing air through the heat sink. The synthetic jets generate a flow rate of 4.48 CFM through the heat sink, resulting in 27.8 W/CFM and thermal effectiveness of 0.62. The effect of fin length on the thermal resistance of the heat sink is discussed. Detailed measurements on an instrumented heat sink estimate that the average heat transfer coefficients in the channel flow between the fins is 2.5 times that of a steady flow in the ducts at the same Reynolds Number.
Skip Nav Destination
e-mail: [email protected]
e-mail: [email protected]
Article navigation
June 2005
Research Papers
Design and Thermal Characteristics of a Synthetic Jet Ejector Heat Sink Available to Purchase
Raghav Mahalingam,
Raghav Mahalingam
Fluid Mechanics and Heat Transfer Research Labs, George W. Woodruff School of Mechanical Engineering,
e-mail: [email protected]
Georgia Institute of Technology
, Atlanta, GA 30332
Search for other works by this author on:
Ari Glezer
Ari Glezer
Fluid Mechanics and Heat Transfer Research Labs, George W. Woodruff School of Mechanical Engineering,
e-mail: [email protected]
Georgia Institute of Technology
, Atlanta, GA 30332
Search for other works by this author on:
Raghav Mahalingam
Fluid Mechanics and Heat Transfer Research Labs, George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332e-mail: [email protected]
Ari Glezer
Fluid Mechanics and Heat Transfer Research Labs, George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
, Atlanta, GA 30332e-mail: [email protected]
J. Electron. Packag. Jun 2005, 127(2): 172-177 (6 pages)
Published Online: December 23, 2004
Article history
Received:
January 27, 2003
Revised:
December 23, 2004
Citation
Mahalingam, R., and Glezer, A. (December 23, 2004). "Design and Thermal Characteristics of a Synthetic Jet Ejector Heat Sink." ASME. J. Electron. Packag. June 2005; 127(2): 172–177. https://doi.org/10.1115/1.1869509
Download citation file:
Get Email Alerts
Thermal Characteristics Dependency of Epoxy Underfill on Crosslinker Molecular Structures and Hardener Concentration in Electronic Packaging
J. Electron. Packag (September 2025)
Three Decades of Thermal Management Research at DARPA
J. Electron. Packag (September 2025)
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology
J. Electron. Packag (September 2025)
On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages
J. Electron. Packag (September 2025)
Related Articles
Fluid Flow and Thermal Characteristics of a Microchannel Heat Sink Subject to an Impinging Air Jet
J. Heat Transfer (July,2005)
Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
J. Electron. Packag (September,2000)
Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components
J. Electron. Packag (March,2004)
Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips
J. Heat Transfer (August,2010)
Related Chapters
Introduction
Thermal Management of Microelectronic Equipment
Outlook
Closed-Cycle Gas Turbines: Operating Experience and Future Potential
System Thermal Analysis—Small Box
Thermal Management of Telecommunications Equipment