In a finite element analysis, when localized behavior of a large model is of particular concern, generally one would refine the mesh until it captures the local solution adequately. Submodeling is an alternative way for solving this kind of problem. It provides a relatively accurate solution at a modest computational cost. For a valid submodeling analysis, the boundaries of the submodel should be sufficiently far away from local features so that St. Venant’s principle holds. Moreover, special treatments are required for solving problems that involve path-dependent characteristics. This paper presents a general procedure to perform submodeling analyses for path-dependent thermomechanical problems without a priori assumptions on the structural response. The procedure was benchmarked using a bimaterial strip and demonstrated through analyses on a bump chip carrier package assembly. The procedure is conducive to the numerical assessment of fatigue lives of electronic packages.
Skip Nav Destination
e-mail: yishao_lai@aseglobal.com
Article navigation
June 2005
Research Papers
Submodeling Analysis for Path-Dependent Thermomechanical Problems
Tong Hong Wang,
Tong Hong Wang
Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc.
, 26 Chin 3rd Rd., Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwan
Search for other works by this author on:
Yi-Shao Lai
e-mail: yishao_lai@aseglobal.com
Yi-Shao Lai
Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc.
, 26 Chin 3rd Rd., Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwan
Search for other works by this author on:
Tong Hong Wang
Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc.
, 26 Chin 3rd Rd., Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwan
Yi-Shao Lai
Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc.
, 26 Chin 3rd Rd., Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwane-mail: yishao_lai@aseglobal.com
J. Electron. Packag. Jun 2005, 127(2): 135-140 (6 pages)
Published Online: September 28, 2004
Article history
Received:
September 22, 2003
Revised:
September 28, 2004
Citation
Wang, T. H., and Lai, Y. (September 28, 2004). "Submodeling Analysis for Path-Dependent Thermomechanical Problems." ASME. J. Electron. Packag. June 2005; 127(2): 135–140. https://doi.org/10.1115/1.1869513
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
J. Electron. Packag (December,2004)
A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects
J. Electron. Packag (March,2009)
A Damage-Mechanics-Based Constitutive Model for Solder Joints
J. Electron. Packag (September,2005)
Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
J. Electron. Packag (March,2008)
Related Proceedings Papers
Related Chapters
Fatigue Analysis in the Connecting Rod of MF285 Tractor by Finite Element Method
International Conference on Advanced Computer Theory and Engineering, 4th (ICACTE 2011)
Subsection NB—Class 1 Components
Companion Guide to the ASME Boiler & Pressure Vessel Codes, Volume 1 Sixth Edition
Subsection NB—Class 1 Components
Companion Guide to the ASME Boiler & Pressure Vessel Code, Volume 1, Second Edition