This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is with tensile strength up to 71 MPa. The potential application of BCB bonding is demonstrated on a concept of wafer-level chip-scale package for RF applications and microfilter array for microfluidic applications.
Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications
Manuscript received January 6, 2004; revision received June 8, 2004. Review conducted by: Y. C. Chan.
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Polyakov, A., Bartek , M., and Burghartz, J. N. (March 21, 2005). "Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications." ASME. J. Electron. Packag. March 2005; 127(1): 7–11. https://doi.org/10.1115/1.1846059
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