Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which many reliability issues arise, including warpage of the package, premature interfacial failure, and degraded interconnections. Bimaterial strip bending experiment has been employed successfully to monitor the evolution of the residual stresses in underfrill resins for flip chip applications. A numerical analysis is developed to predict the residual stresses, which agree well with the experimental measurements. The changes of material properties, such as flexural modulus and coefficient of thermal expansion, of the resins with temperature are taken into account in the finite element analysis.
Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
Manuscript received March 9, 2004; revision received August 4, 2004. Review conducted by: Y. C. Chan.
- Views Icon Views
- Share Icon Share
- Cite Icon Cite
- Search Site
Sham, M., and Kim, J. (March 21, 2005). "Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications." ASME. J. Electron. Packag. March 2005; 127(1): 47–51. https://doi.org/10.1115/1.1849232
Download citation file:
- Ris (Zotero)
- Reference Manager