Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which many reliability issues arise, including warpage of the package, premature interfacial failure, and degraded interconnections. Bimaterial strip bending experiment has been employed successfully to monitor the evolution of the residual stresses in underfrill resins for flip chip applications. A numerical analysis is developed to predict the residual stresses, which agree well with the experimental measurements. The changes of material properties, such as flexural modulus and coefficient of thermal expansion, of the resins with temperature are taken into account in the finite element analysis.
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March 2005
Article
Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
Man-Lung Sham,
Man-Lung Sham
Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong
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Jang-Kyo Kim
Jang-Kyo Kim
Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong
Search for other works by this author on:
Man-Lung Sham
Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong
Jang-Kyo Kim
Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong
Manuscript received March 9, 2004; revision received August 4, 2004. Review conducted by: Y. C. Chan.
J. Electron. Packag. Mar 2005, 127(1): 47-51 (5 pages)
Published Online: March 21, 2005
Article history
Received:
March 9, 2004
Revised:
August 4, 2004
Online:
March 21, 2005
Citation
Sham, M., and Kim, J. (March 21, 2005). "Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications." ASME. J. Electron. Packag. March 2005; 127(1): 47–51. https://doi.org/10.1115/1.1849232
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