We have demonstrated the self-alignment processes using surface tension of the resin material for the self-assembly systems. It has been known that the surface tension of the resin material is too low to achieve the self-alignment capability. This paper presents a fundamental concept and principles of resin self-alignment processes. The numerical analysis is conducted to enhance understandings of resin self-alignment behavior and the relationship between process-related parameters. It was proved that resin self-alignment is different from the oscillatory motion of solder self-alignment and shows overdamped motion by the experiment. We could achieve the precise alignment of less than 0.4 μm.
Resin Self-Alignment Processes for Self-Assembly Systems
Manuscript received January 6, 2004; revision received July 8, 2004. Review conducted by: Y. C. Chan.
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Kim, J., Yasuda, K., and Fujimoto, K. (March 21, 2005). "Resin Self-Alignment Processes for Self-Assembly Systems ." ASME. J. Electron. Packag. March 2005; 127(1): 18–24. https://doi.org/10.1115/1.1846061
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