In order to conquer the limitation of conventional solders and adhesives used in electronics packaging, a novel self-organized joining process using conductive adhesive with low melting point alloy was proposed. As a basic characteristic of the adhesive paste, the differential scanning calorimetry analysis was carried out. Joint morphology, the formation of conduction path, and the self-organized characteristics were examined. Melting fillers were preserved their initial spherelike form for nonreductive adhesive, although enlargement of the alloy colony occurred in the case of the reductive polymer. The formation of a conduction path can be controlled significantly by varying the resin performance and the process parameters such as the joint height and the volume fraction of filler. The self-organized characteristic was observed on the copper line patterned glass-epoxy substrate. The matched pair of substrates could be interconnected with excellent self-organized joint.
Adhesive Joining Process and Joint Property With Low Melting Point Filler
Manuscript received January 6, 2004; revision received July 8, 2004. Review conducted by: Y. C. Chan.
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Yasuda, K., Kim, J., and Fujimoto, K. (March 21, 2005). "Adhesive Joining Process and Joint Property With Low Melting Point Filler." ASME. J. Electron. Packag. March 2005; 127(1): 12–17. https://doi.org/10.1115/1.1846060
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