Plane two-dimensional finite element analysis was applied to study the effect of underfill thermomechanical properties on the potential of thermal fatigue failure for flip-chip ball grid array. Two-stage as well as constant thermomechanical properties of underfills were manipulated to represent extremes of practical underfills. The steady-state creep model was incorporated for the eutectic solder bump to represent its real behavior. It was found from the parametric studies that the underfill with high Young’s modulus, low coefficient of thermal expansion, and high glass transition temperature leads to the longest service life.

Issue Section:
Technical Brief
Keywords:
ball grid arrays, flip-chip devices, failure (mechanical), integrated circuit reliability, integrated circuit packaging, creep testing, thermal stress cracking, solders, Young's modulus, thermal expansion, glass transition, thermal analysis, finite element analysis
Topics:
Ball-Grid-Array packaging, Creep, Fatigue, Flip-chip, Materials properties, Reliability, Solders, Thermomechanics, Shear (Mechanics), Finite element analysis, Young's modulus, Thermal expansion, Fatigue failure, Glass transition
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 by ASME
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