The results of a study of a new and unique high-performance air-cooled impingement heat sink are presented. An extensive numerical investigation of the heat sink performance is conducted and is verified by experimental data. The study is relevant to cooling of high-power chips and modules in air-cooled environments and applies to workstations or mainframes. In the study, a rectangular jet impinges on a set of parallel fins and then turns into cross flow. The effects of the fin thickness, gap nozzle width and fin shape on the heat transfer and pressure drop are investigated. It is found that pressure drop is reduced by cutting the fins in the central impingement zone without sacrificing the heat transfer due to a reduction in the extent of the stagnant zone. A combination of fin thicknesses of the order of 0.5 mm and channel gaps of 0.8 mm with appropriate central cutout yielded heat transfer coefficients over 1500 W/m2 K at a pressure drop of less than 100 N/m2, as is typically available in high-end workstations. A detailed study of flow-through heat sinks subject to the same constraints as the impingement heat sink showed that the flow-through heat sink could not achieve the high heat transfer coefficients at a low pressure drop.
Skip Nav Destination
Article navigation
December 2004
Research Papers
An Analytical Study of the Optimized Performance of an Impingement Heat Sink
B. G. Sammakia
B. G. Sammakia
Search for other works by this author on:
S. B. Sathe
SUNY Binghamton, NY 13902
B. G. Sammakia
Manuscript received June 11, 2004; revision received August 10, 2004. Review conducted by: D. Agonafer.
J. Electron. Packag. Dec 2004, 126(4): 528-534 (7 pages)
Published Online: January 24, 2005
Article history
Received:
June 11, 2004
Revised:
August 10, 2004
Online:
January 24, 2005
Citation
Sathe , S. B., and Sammakia, B. G. (January 24, 2005). "An Analytical Study of the Optimized Performance of an Impingement Heat Sink ." ASME. J. Electron. Packag. December 2004; 126(4): 528–534. https://doi.org/10.1115/1.1827269
Download citation file:
Get Email Alerts
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Related Articles
Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks
J. Electron. Packag (September,2001)
Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
J. Electron. Packag (September,2002)
Liquid Single-Phase Flow in an Array of Micro-Pin-Fins—Part II: Pressure Drop Characteristics
J. Heat Transfer (December,2008)
Experimental Study of
Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat
Sink
J. Electron. Packag (December,2007)
Related Proceedings Papers
Related Chapters
Introduction
Thermal Management of Microelectronic Equipment
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment