This paper describes a general methodology of how electrical circuit design data are mapped into an intermediate analyzable representation that supports the information requirement of several thermomechanical analyses, including product optimization/idealization. This paper describes other issues encountered, such as how to integrate product data that spans more than one tool, how to modify and add analysis data necessary during analysis, and how to use data stored in the analysis module from different programing environments. The advantage this process offers is also described by considering a PWBA (Printed Wiring Board Assembly) design, such as layout and layup in an electrical design system.

Issue Section:
Research Paper
Keywords:
printed circuits, printed circuit design, product development, circuit analysis computing, thermal analysis, electrical engineering computing
Topics:
Design, Mechanical computer-aided design, Printed circuit boards, Manufacturing
1.
Suhir, E., and Weld, J. D., 1996, “Application of Surrogate Layer for Lower Bending Stress in a Tri-Material Body,” Proc. of ASME International Mechanical Engineering Congress and Exposition, Dallas, ASME, New York, WA/EEP-1, pp. 435–439.
2.
Ahn, W., and Agonafer, D., 2003, The Impact of Board Layout and Stack-Up on PWB Warpage During Fabrication and Reflow Soldering Process, UTA-SUN Project Report.
3.
Wang, P., Huang, G., Ching, H., Hsu, H., Novotny, S., Ahn, W., and Agonafer, D., 2004, μPGA Socket and Solder Joint Reliability Study, Proc. of Pan Pacific Electronic Conference and SMTA, 3, Kauai, Hawaii, pp. 67–84.
4.
Morgan
,
H. S.
,
1995
, “
Thermal Stress in Layered Electrical Assemblies Bonded With Solder
,”
ASME J. Electron. Packag.
,
114
, pp.
350
–
354
.
5.
Tierney
,
J. W.
, and
Eischen
,
J. W.
,
1997
, “
Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading
,”
ASME J. Electron. Packag.
,
119
, pp.
281
–
287
.
6.
Cifuentes
,
A. O.
, and
Shareef
,
I. A.
,
1993
, “
Some Modeling Issues on the Finite Element Computation of Thermal Stress in Metal Lines
,”
ASME J. Electron. Packag.
,
115
, pp.
392
–
403
.
7.
Kelly, G. et al., 1994, Accurate Prediction of PQFP Warpage, Proc. of Electronic Components and Technology Conference, Washington, DC, pp. 102–106.
8.
Structural Dynamic Research Corp., 2002, PCB.xchange and PCB.modleler User’s Guide.
9.
Cadence, 2002, Allegro/APD Design Guide User’s Manual.
10.
Intermediate Design Integration, IDF Instructions.
11.
Maya Heat Transfer Technologies, web site: www.mayahtt.com
Copyright © 2004
 by ASME
You do not currently have access to this content.