This paper focuses on the effect on rack inlet air temperatures as a result of maldistribution of airflows exiting the perforated tiles located adjacent to the fronts of the racks. The flow distribution exiting the perforated tiles was generated from a computational fluid dynamics (CFD) tool called Tileflow (trademark of Innovative Research, Inc.). Both raised floor heights and perforated tile-free areas were varied in order to explore the effect on rack inlet temperatures. The flow distribution exiting the perforated tiles was used as boundary conditions to the above-floor CFD model. A CFD model was generated for the room with electronic equipment installed on a raised floor. Forty racks of data processing (DP) equipment were arranged in rows in a data center cooled by chilled air exhausting from perforated floor tiles. The chilled air was provided by four A/C units placed inside a room 12.1 m wide×13.4 m long. Because the arrangement of the racks in the data center was symmetric, only half of the data center was modeled. The numerical modeling for the area above the raised floor was performed using a commercially available finite control volume computer code called Flotherm (trademark of Flomerics, Inc.). The flow was modeled using the turbulence model. Results are displayed to provide some guidance on the design and layout of a data center.
Skip Nav Destination
Article navigation
December 2004
Research Papers
Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures
Ethan Cruz
Ethan Cruz
Search for other works by this author on:
Roger Schmidt
Ethan Cruz
Manuscript received May 14, 2004; revision received October 5, 2004. Review conducted by: B. Sammakia.
J. Electron. Packag. Dec 2004, 126(4): 510-518 (9 pages)
Published Online: January 24, 2005
Article history
Received:
May 14, 2004
Revised:
October 5, 2004
Online:
January 24, 2005
Citation
Schmidt, R., and Cruz, E. (January 24, 2005). "Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures ." ASME. J. Electron. Packag. December 2004; 126(4): 510–518. https://doi.org/10.1115/1.1827266
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
J. Electron. Packag (September,2022)
Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements
J. Electron. Packag (September,2020)
Recent Advances in Numerical Methods for Fluid Dynamics and Heat Transfer
J. Fluids Eng (July,2005)
CFD Analysis of Compressible Flow Across a Complex Geometry Venturi
J. Fluids Eng (September,2007)
Related Proceedings Papers
Related Chapters
Natural Gas Transmission
Pipeline Design & Construction: A Practical Approach, Third Edition
Applications
Introduction to Finite Element, Boundary Element, and Meshless Methods: With Applications to Heat Transfer and Fluid Flow
Thermoelectric Coolers
Thermal Management of Microelectronic Equipment