In all electronics cooling situations, and many other practical situations, the surface temperature may vary rapidly in the streamwise direction. In these cases, defining the heat transfer coefficient using the adiabatic temperature of the surface instead of the mixed mean temperature of the coolant results in significant benefits. The resulting coefficient, called is well behaved, being a function only of the geometry and flow characteristics. Calling attention to as opposed to helps designers identify the root cause of overheating problems and more quickly reach good solutions. The theoretical and practical bases for are presented. Examples of its use in electronics cooling are described to show the operational advantages this approach offers. Turbulence strongly affects heat transfer. A simple, turbulence-based correlation is presented that yields an estimate of the heat transfer coefficient good enough for preliminary design estimates and often as accurate as can be relied on from CFD calculations using present codes.
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December 2004
Research Papers
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Robert J. Moffat
Robert J. Moffat
Stanford University, Stanford, CA (Emeritus)
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Robert J. Moffat
Stanford University, Stanford, CA (Emeritus)
Manuscript received May 10, 2004; revision received October 5, 2004. Review conducted by: B. Sammakia.
J. Electron. Packag. Dec 2004, 126(4): 501-509 (9 pages)
Published Online: January 24, 2005
Article history
Received:
May 10, 2004
Revised:
October 5, 2004
Online:
January 24, 2005
Citation
Moffat, R. J. (January 24, 2005). " and ." ASME. J. Electron. Packag. December 2004; 126(4): 501–509. https://doi.org/10.1115/1.1827265
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