An effective method for predicting and optimizing the thermal performance of heat sinks with Parallel-Plain Fin under a given design constraint of pressure drop has been successfully developed in the study. The thermal and hydrodynamic performance analyzers for PPF heat sinks have been developed. A screening experimental design using the Taguchi method is performed to determine key factors that are critical to the design and screen out unimportant design factors; and a Response Surface Methodology is then applied to establish analytical models for the thermal resistance and pressure drop in terms of the key design factors with a CCD experimental design. By employing the Sequential Quadratic Programming technique, a series of constrained optimal designs can be efficiently performed. Comparisons between these predicted optimal designs and those evaluated by the theoretical calculations are made with satisfactory agreement.

Issue Section:
Research Paper
Keywords:
heat sinks, thermal management (packaging), product design, thermal analysis, Taguchi methods, quadratic programming, response surface methodology, thermal resistance, Optimal Thermal Design, PPF, Heat Sink, DOE, CCD, RSM, SQP, Thermal Resistance, Pressure Loss
Topics:
Design, Heat sinks, Optimization
1.
Van De Pol, D. W., and Tierney, J. K., 1974, “Free Convection Heat Transfer From Vertical Fin-Arrays,” IEEE Transactions on Parts, Hybrids, and Packaging, Vol. PHP-10, No. 4, Dec. 1974, pp. 267–271.
2.
Ellison, G. N., 1989, Thermal Computations for Electronic Equipment, 2nd ed., Van Nostrand Reinhold Corporation, New York.
3.
Knight
,
R. W.
, and
Gooding
,
J. S.
,
1991
, “
Optimal Thermal Design of Forced Convection Heat Sinks-Analytical
,”
ASME J. Electron. Packag.
,
113
, pp.
313
–
321
.
4.
Kraus, A. D., and Bar-Cohen, A., 1995, Design and Analysis of Heat Sinks, John Wiley and Sons, Inc., New York.
5.
Ishizuka, M., Yokono, Y., and Hisano, K., 1999, “Experimental Study on The Performance of Compact Heat Sink for LSI Packages,” ASME Advances in Electronic Packaging, Vol. 26-1.
6.
Chen, W. H., Cheng, H. C., and Shen, H. A., 2001, “On Effective Thermal Characterization of Electronic Packaging,” IPACK2001-15836, Proceedings of InterPACK’01, InterPACK 2001, Kauai, Hawaii, July 8–13.
7.
Sarvar
,
F.
,
Whalley
,
D. C.
, and
Low
,
M. K.
,
2001
, “
IGBT Package Design for High Power Aircraft Electronic Systems
,”
ASME J. Electron. Packag.
,
123
, pp.
338
–
343
.
8.
Gooding
,
J. S.
,
Jaeger
,
R. C.
,
Mackowski
,
D. W.
,
Fahrner
,
C. J.
, and
Hingorani
,
S.
,
1994
, “
Optimal Sizing of Planar Thermal Spreaders
,”
ASME J. Heat Transfer
,
116
, pp.
296
–
301
.
9.
Mills, A. F., 1999, Basic Heat and Mass Transfer, Prentice–Hall, Inc., Englewood Cliffs, NJ.
10.
Iwasaki, H., Sasaki, T., and Ishizuka, M., 1994, “Cooling Performance of Plate Fins for Multichip Modules,” IEEE InterSociety Conference on Thermal Phenomena, pp. 144–147.
11.
Wu, C. F., and Hamada, M., 2000, Experiments—Planning, Analysis, and Parameter Design Optimization, John Wiley & Sons, Inc., New York.
12.
Taguchi, G., 1993, Taguchi on Robust Technology Development, ASME Press, New York.
13.
Mertol, A., 1995, “Application of the Taguchi Method on the Robust Design of Molded 225 Plastic Ball Grid Array Packages,” IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B, Vol. 18, No. 4, pp. 734–743.
14.
Myers, G. N., and Montgomery, D. C., 2002, Response Surface Methodology, 2nd ed., John Wiley & Sons, New York.
15.
Seri, L., 1995, “Optimum Design and Selection of Heat Sinks,” IEEE Semi-Therm Symposium, 11th, pp. 48–54.
16.
Vanderplaats, G. N., 1993, Numerical Optimization Techniques for Engineering Design, McGraw-Hill, Inc., Singapore.
17.
Schittkowski
,
K.
,
1985
, “
NLQPL: A FORTRAN-Subroutine Solving Constrained Nonlinear Programming Problems
,”
Ann. Operat. Res.
,
5, pp.
485
–
500
.
Copyright © 2004
 by ASME
You do not currently have access to this content.