One possible failure mechanism of products containing polyimide dielectric is deadhesion of polyimide from neighboring metallization. Deadhesion usually occurs due to the combined damage mechanisms of environmental aging and fatigue. In this paper, the rate of aging of Kapton-E polyimide is quantified as a function of temperature and humidity exposure using peel and tensile tests. An accelerated test methodology that accounts for both aging and fatigue and that can be used to evaluate the resistance of electronic products to polyimide deadhesion is then proposed.
Environmental Aging and Deadhesion of Polyimide Dielectric Films
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received April 2004. Associate Editor: Y. C. Lee.
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Murray , S., Hillman , C., and Pecht, M. (October 6, 2004). "Environmental Aging and Deadhesion of Polyimide Dielectric Films ." ASME. J. Electron. Packag. September 2004; 126(3): 390–397. https://doi.org/10.1115/1.1773853
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