A field-use induced damage mapping methodology is presented that can take into consideration the field-use thermal environment profile to develop accelerated thermal cycling guidelines for packages intended to be used in military avionics thermal environment. The board-level assembly process mechanics and critical geometric features with appropriate material models are taken into consideration while developing the methodology. The models developed are validated against in-house and published accelerated thermal cycling experimental data. The developed mapping methodology is employed to design alternate accelerated thermal cycles by matching the creep and plastic strain contributions to total inelastic strain accumulation in solder under military field-use and accelerated thermal cycling environments, while reducing the time for accelerated thermal cycling and qualification.
Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 2003; final revision, Jan. 04. Associate Editor: G.-Q. Lu.
- Views Icon Views
- Share Icon Share
- Cite Icon Cite
- Search Site
Pucha, R. V., Tunga , K., Pyland , J., and Sitaraman, S. K. (July 8, 2004). "Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment ." ASME. J. Electron. Packag. June 2004; 126(2): 256–264. https://doi.org/10.1115/1.1756150
Download citation file:
- Ris (Zotero)
- Reference Manager