Relationships between microstructural and mechanical aging effects in eutectic PbSn and Pb-free solder alloy Sn3.9Ag0.6Cu are reported and compared. The room temperature aged Sn3.9Ag0.6Cu alloy continually age-softened, this softening correlated with the growth of relatively large tin-rich crystals. The aged Sn3.9Ag0.6Cu alloy initially age-softened, and the minimum flow strength was reached after one day at This softening correlated with the growth of relatively large tin-rich crystals and with the coarsening of particles. When aged at beyond one day the Sn3.9Ag0.6Cu alloy age-hardened, the hardening correlated with the dispersion of particles into tin-rich crystals which previously had not contained intermetallic precipitates.
Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 2003; final revision, December 2003. Associate Editor: M. Saka.
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Xiao , Q., Bailey , H. J., and Armstrong, W. D. (July 8, 2004). "Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy ." ASME. J. Electron. Packag. June 2004; 126(2): 208–212. https://doi.org/10.1115/1.1756144
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