The present work studies the mechanical properties of mechanically polished gold wire and wirebond using nanoindentation. Metallography of wirebond reveals undesirable coarse grain structure in HAZ due to recrystallization and grain growth. For our gold wire, the recrystallization temperature found using D.S.C. was 340.66°C and the dopants were identified using TOF-SIMS and hardness dependence on load was studied using nanoindentation. The nanoindentation of wirebond has confirmed a -shaped hardness profile with minima at 166 μm along the HAZ. The elastic modulus varied independent of the microstructure. A yield stress profile based on empirical hardness-yield strength correlation is predicted for the wirebond.
Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Oct. 2003. Associate Editor: B. Michel.
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Shah, M., Zeng, K., and Tay, A. A. O. (April 30, 2004). "Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation ." ASME. J. Electron. Packag. March 2004; 126(1): 87–93. https://doi.org/10.1115/1.1648062
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