An investigation of the flip-chip bonding process for application in MEMS devices was carried out. Finite element analyses of axisymmetric and non-axisymmetric solder joint geometries were performed. It was found that in typical cases of MEMS devices in which the solder volume is small where is the Bond number), the finite element solution of the axisymmetric solder joint is well approximated by a surface of revolution whose generating meridian is a circular arc. Experimental results of solder joints in flip-chip assembly were found to correlate well with simulation results.
Investigation of Flip-Chip Bonding for MEMS Applications
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 2003. Associate Editor. Y. C. Lee.
- Views Icon Views
- Share Icon Share
- Cite Icon Cite
- Search Site
Salalha , W., Zussman, E., and Bar-Yoseph, P. Z. (April 30, 2004). "Investigation of Flip-Chip Bonding for MEMS Applications ." ASME. J. Electron. Packag. March 2004; 126(1): 48–51. https://doi.org/10.1115/1.1646427
Download citation file:
- Ris (Zotero)
- Reference Manager