Two high profile goals of the electronics industry today are lead free and embedded passives. The following describes the design and construction of a populated and planarized “PCB” which accomplishes these goals. The Moulded Electronic Package also integrates bare die and other components without the use of solder, wire bonding or flip chip attach. The result is a completely populated package including EMI shielding without the need for expensive metal packages. The technology described is fully additive, using both readily available, Polymer Thick Film materials and a new, high conductivity material. High Density Interconnection is accomplished either by direct printing of 75 micron conductor traces or, for smaller dimensions, conductive ink deposited in specially “patterned” dielectric.
The Moulded Electronic Package (MEP)
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received April 2001. Associate Editor: B. Michel.
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Lowrie, D. J. J. (April 30, 2004). "The Moulded Electronic Package (MEP) ." ASME. J. Electron. Packag. March 2004; 126(1): 34–36. https://doi.org/10.1115/1.1646424
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