Recently awarded U.S. patents and proven in the lab, our versatile high temperature superconductor (HTS) ceramic nanotechnology utilizes a novel material formulation of nanosize HTS ceramic powder and of multi-purpose silicone polymer additive. Inexpensive ceramic-silicone processing (CSP) of superconductor wire and other adhesion substrate coated materials, electronics and various bulk materials resulted in electricity throughput of up to copper wire throughput at significantly decreased operating voltage and energy losses. All HTS-CSP materials have the required mechanical properties and durability and can be conveyor manufactured in any size and shape, including continuous flexible multi-strand round wire and electronics.
Engineering of Superconductive Ceramics
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 2003. Associate Editor: B. Michel.
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Rokhvarger, A. E., and Chigirinsky, L. A. (April 30, 2004). "Engineering of Superconductive Ceramics ." ASME. J. Electron. Packag. March 2004; 126(1): 26–33. https://doi.org/10.1115/1.1646423
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