Solder bridging is one of the most serious defects of solder joint in fine pitch device assemblies. It is known that the generation of solder bridging is closely related to the forming process of solder joints. To simulate the process, a 3D model is formed. Then it is numerically simulated using Surface Evolver program. Based on the results, the solder bridging mechanism and the effective factors including wetting angle and surface tension are investigated.
Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received February 2003. Associate Editor. B. Michel.
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Yu, L. M., Sur , B. H., Pyo, K. Y., Qing, W. C., and Lei, Z. (April 30, 2004). "Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices ." ASME. J. Electron. Packag. March 2004; 126(1): 22–25. https://doi.org/10.1115/1.1646421
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