The peeling stress near the free edge of a bimaterial beam under uniform temperature change creates a moment which causes both layers to have identical curvatures at the interface. A new formula from beam theory is given for this Peeling Moment. A beam with a negative Peeling Moment resists delamination at the free edge. A physical explanation for the moment is developed; the sign of the Peeling Moment is also the determinant of the location of the equivalent centroid of the bimaterial beam. This provides a valuable new rule for designing resistance to thermomechanical delamination of a bimaterial structure.
The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received January 2003; final revision, September 2003. Associate Editor: E. Lorenzini.
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Moore, T. D., and Jarvis, J. L. (April 30, 2004). "The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies ." ASME. J. Electron. Packag. March 2004; 126(1): 106–109. https://doi.org/10.1115/1.1649240
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