In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous chemical reaction of the Sn layer and the layer. The Sn layer is assumed to be an elasto-plastic material. The results presented herein is useful in understanding why the compressive stress in the Sn layer can initiate a tin whisker near the weak spot of a SnOx layer.
3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Oct. 2002. Associate Editor: E. Suhir.
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Lau , J. H., and Pan , S. H. (December 15, 2003). "3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components ." ASME. J. Electron. Packag. December 2003; 125(4): 621–624. https://doi.org/10.1115/1.1604805
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