An exact analysis is presented for the stresses and deflections of circular plates (glass windows) elastically restrained along its edge in a photonic device’s housing subjected to the pressure and temperature loadings. Dimensionless curves and charts are also provided for engineering practice convenience. These charts show the interactions of the deflection, stress, temperature, pressure, linear spring constant, rotational spring constant, geometry of the glass windows, and the Young’s modulus, Poisson’s ratio, thermal coefficient of expansion, geometry, stress-optical coefficient, and birefringence of glass materials. The results presented herein should be useful for designing glass windows for shipping, storing, handling, functioning, and reliability.
Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Feb. 2003. Associate Editor: E. Suhir.
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Lau , J. H., Erasmus, S., and Zou, Y. (December 15, 2003). "Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device ." ASME. J. Electron. Packag. December 2003; 125(4): 602–608. https://doi.org/10.1115/1.1604807
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