The analysis of a thermo-pneumatic actuation unit for its use in a micropump has been carried out. Coupled thermo-mechanical simulations by finite element method (FEM) (with ANSYS software) were required because of the complexity of the device. The simulation results were validated by thermal and mechanical experimental results, showing a good agreement. FEM results have been used to extract a high level model of the actuation unit that can be used to estimate the maximum performance of the micropump operation with this actuation unit. In order to identify the best frequency of operation for the pump, a quality parameter has been defined based on the thermal dynamics of the actuation unit.

1.
Olsson, A., Enoksson, P., Stemme, E., and Stemme, G., 1995, “A Valve-less Planar Pump Isotropically Etched in Silicon,” MME’95, Ostrava, September, pp. 120–123.
2.
Zengerle, R., Richter, A., and Sandmaier, H., 1992, “A Micro Membrane Pump with Electrostatic Actuation,” MEMS’92, Travemu¨nde, February, pp. 19–24.
3.
Van de Pol
,
F. C. M.
,
Wonnink
,
D. G. J.
,
Elwenspoek
,
M.
, and
Fluitman
,
J. H. J.
,
1989
, “
A Thermo-Pneumatic Actuation Principle for a Microminiature Pump and Other Micromechanical Devices
,”
Sens. Actuators
,
17
, pp.
139
143
.
4.
Van de Pol
,
F. C. M.
,
Elwenspoek
,
M.
, and
Fluitman
,
J. H. J.
,
1990
, “
A Thermopneumatic Micropump Based on Micro-Engineering Techniques
,”
Sens. Actuators A
,
A21–23
, pp.
198
202
.
5.
Zengerle
,
R.
,
Geiger
,
W.
,
Richter
,
M.
,
Ulrich
,
J.
,
Kluge
,
S.
, and
Richter
,
A.
,
1995
, “
Transient Measurements on Miniaturized Diaphragm Pumps in Microfluid Systems
,”
Sens. Actuators A
,
A46–47
, pp.
557
561
.
6.
Carmona, M., 2000, “Modelizacio´n y Simulacio´n de Microsistemas: Aplicacio´n a Componentes de Microfluı´dica,” Ph.D. thesis, Universitat de Barcelona.
7.
Acero
,
M. C.
,
Plaza
,
J. A.
,
Esteve
,
J.
,
Carmona
,
M.
,
Marco
,
S.
, and
Samitier
,
J.
,
1997
, “
Design of a modular micropump based on anodic bonding
,”
J. Micromech. Microeng.
,
7
, pp.
179
182
.
8.
Marco, S., Carmona, M., and Samitier, J., 1998, “Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations,” MSM’98, California, April, pp. 157–162.
9.
Carmona, M., Marco, S., and Samitier, J., 2001, “Performance of a Thermo-Pneumatic Actuated Micropump: Influence of the Fluidic Components,” Benefiting from thermal and mechanical simulation in Micro-Electronics, EuroSimE’01, Europia, Paris, pp. 291–296.
10.
Rencz, M., Sze´kely, V., Koha´ri, Zs., Ress, S., and Poppe, A., 1999, “Thermal Evaluation of the SIP9 Package,” THERMINIC’99, Rome, October, pp. 111–116.
11.
Goodson
,
K. E.
,
Flik
,
M. I.
,
Su
,
L. T.
, and
Antoniadis
,
D. A.
,
1993
, “
Annealing Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide layers
,”
IEEE Electron Device Letters
,
14
, pp.
490
492
.
12.
Paul, O., von Arx, M., and Baltes, H., 1995, “Process-Dependent Thermophysical Properties of CMOS IC Thin Films,” in Digest of Technical Papers, Proceedings of the Transducers’95, Vol 1, Stockholm, June 25–29, pp. 178–181.
13.
Carmona
,
M.
,
Marco
,
S.
,
Palacin
,
J.
, and
Samitier
,
J.
,
1999
, “
A Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Form
,”
IEEE Transactions on Components and Packaging Technology
,
22, 2
, pp.
238
244
.
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