The present study focuses on the development of reliable response surface models (RSM’s) for the major packaging processes of a typical electronic package. The major objective is to optimize the product/process designs against the possible failure mode of vertical die cracks. First, the finite element mode (FEM)-based physics of failure models are developed and the reliability of the predicted stress levels was verified by experiments. In the development of reliable thermo-mechanical simulation models, both the process (time and temperature) dependent material nonlinearity and geometric nonlinearity are taken into account. Afterwards, RSM’s covering the whole specified geometric design spaces are constructed. Finally, these RSM’s are used to predict, evaluate, optimize, and eventually qualify the thermo-mechanical behavior of this electronic package against the actual design requirements prior to major physical prototyping and manufacturing investments.
Response Surface Modeling for Nonlinear Packaging Stresses
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Nov. 2002. Associate Editor: L. Ernst.
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van Driel, W. D., Zhang, G. Q., Janssen, J. H. J., and Ernst, L. J. (December 15, 2003). "Response Surface Modeling for Nonlinear Packaging Stresses ." ASME. J. Electron. Packag. December 2003; 125(4): 490–497. https://doi.org/10.1115/1.1604149
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