In the present paper, a deformation induced in a new bonding technology of chip-scale package (CSP) using resin encapsulation sheets is examined numerically and experimentally. Deflections after cooling from a bonding temperature are measured experimentally for various kinds of substrate and the thickness of an integrated circuit using a laser beam. In particular, a simple theory on the basis of a multilayered plate theory considering a viscoelastic property in the substrate is presented, and the thermo-viscoelastic analysis for the deflection of CSP is performed. Furthermore, the thermo-elastoplastic finite element method analysis is performed under the same temperature history. We could show that the simple formula for multilayered plates based on the thermo-viscoelatic theory can estimate fairly well the deflection of CSP in experiment.
Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 2002. Associate Editor: B. Courtois.
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Koguchi, H., Sasaki, C., and Nishida, K. (September 17, 2003). "Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages ." ASME. J. Electron. Packag. September 2003; 125(3): 414–419. https://doi.org/10.1115/1.1602705
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