In the present paper, a deformation induced in a new bonding technology of chip-scale package (CSP) using resin encapsulation sheets is examined numerically and experimentally. Deflections after cooling from a bonding temperature are measured experimentally for various kinds of substrate and the thickness of an integrated circuit using a laser beam. In particular, a simple theory on the basis of a multilayered plate theory considering a viscoelastic property in the substrate is presented, and the thermo-viscoelastic analysis for the deflection of CSP is performed. Furthermore, the thermo-elastoplastic finite element method analysis is performed under the same temperature history. We could show that the simple formula for multilayered plates based on the thermo-viscoelatic theory can estimate fairly well the deflection of CSP in experiment.
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September 2003
Technical Papers
Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages
Hideo Koguchi,
Hideo Koguchi
Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, Niigata, 940-2188, Japan
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Chie Sasaki,
Chie Sasaki
Matushita Electric Industrial Co., LTD. 2-7, Matsuba-cho, Kadoma, Osaka, 576-0053, Japan
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Kazuto Nishida
Kazuto Nishida
Matushita Electric Industrial Co., LTD. 2-7, Matsuba-cho, Kadoma, Osaka, 576-0053, Japan
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Hideo Koguchi
Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, Niigata, 940-2188, Japan
Chie Sasaki
Matushita Electric Industrial Co., LTD. 2-7, Matsuba-cho, Kadoma, Osaka, 576-0053, Japan
Kazuto Nishida
Matushita Electric Industrial Co., LTD. 2-7, Matsuba-cho, Kadoma, Osaka, 576-0053, Japan
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 2002. Associate Editor: B. Courtois.
J. Electron. Packag. Sep 2003, 125(3): 414-419 (6 pages)
Published Online: September 17, 2003
Article history
Received:
July 1, 2002
Online:
September 17, 2003
Citation
Koguchi, H., Sasaki, C., and Nishida, K. (September 17, 2003). "Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages ." ASME. J. Electron. Packag. September 2003; 125(3): 414–419. https://doi.org/10.1115/1.1602705
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