Flip chip assemblies used in electronic packaging consist of three main components (layers): chip, underfill, and substrate. In this paper, the flip chip assembly is represented as a bi-material strip consisting of the chip and underfill. Our analysis is focused on delamination along the chip-underfill interface due to thermal loading. The underfill is modeled as a composite material made of a polymer matrix and silica particles. Interfacial stresses are studied for several particle configurations: cases of one, two, or three particles near the interface and 30 different random particle arrangements. Interfacial fracture is investigated by evaluating the J integral and stress intensity factors. Statistics of random particle arrangements in the underfill are also discussed. The interfacial stress and fracture analyses give the same trends.
Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Sept. 2002. Associate Editor: Z. Suo.
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Park, J. E., Jasiuk, I., and Zubelewicz, A. (September 17, 2003). "Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill ." ASME. J. Electron. Packag. September 2003; 125(3): 400–413. https://doi.org/10.1115/1.1602480
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