Flip chip assemblies used in electronic packaging consist of three main components (layers): chip, underfill, and substrate. In this paper, the flip chip assembly is represented as a bi-material strip consisting of the chip and underfill. Our analysis is focused on delamination along the chip-underfill interface due to thermal loading. The underfill is modeled as a composite material made of a polymer matrix and silica particles. Interfacial stresses are studied for several particle configurations: cases of one, two, or three particles near the interface and 30 different random particle arrangements. Interfacial fracture is investigated by evaluating the J integral and stress intensity factors. Statistics of random particle arrangements in the underfill are also discussed. The interfacial stress and fracture analyses give the same trends.
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e-mail: ji.e.park@lmco.com
e-mail: iwona.jasiuk@me.gatech.edu
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September 2003
Technical Papers
Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill
Ji Eun Park,
e-mail: ji.e.park@lmco.com
Ji Eun Park
Lockheed Martin Aeronautics Company, 86 South Cobb Dr., Dept. 6E5M Zone 0987, Marietta, GA 30063-0915
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Iwona Jasiuk,
e-mail: iwona.jasiuk@me.gatech.edu
Iwona Jasiuk
Georgia Institute of Technology, The G. W. W. School of Mechanical Engineering, Atlanta, GA 30332-0405
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Aleksander Zubelewicz
Aleksander Zubelewicz
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Ji Eun Park
Lockheed Martin Aeronautics Company, 86 South Cobb Dr., Dept. 6E5M Zone 0987, Marietta, GA 30063-0915
e-mail: ji.e.park@lmco.com
Iwona Jasiuk
Georgia Institute of Technology, The G. W. W. School of Mechanical Engineering, Atlanta, GA 30332-0405
e-mail: iwona.jasiuk@me.gatech.edu
Aleksander Zubelewicz
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Sept. 2002. Associate Editor: Z. Suo.
J. Electron. Packag. Sep 2003, 125(3): 400-413 (14 pages)
Published Online: September 17, 2003
Article history
Received:
September 1, 2002
Online:
September 17, 2003
Citation
Park, J. E., Jasiuk, I., and Zubelewicz, A. (September 17, 2003). "Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill ." ASME. J. Electron. Packag. September 2003; 125(3): 400–413. https://doi.org/10.1115/1.1602480
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