In this study, numerical investigations are performed to examine the influence of unsteady submerged dielectric liquid (HFE-8401HT) jets impinging on electronic chip surfaces. The problem considered here involves conjugate heat transfer. Two different jet inlet velocity waveforms are studied—step and sinusoidal—over the range of frequencies 0.03–4.0 Hz, with the Reynolds number, based on jet inlet width, of up to 100. Results for chip surface temperatures and average Nusselt numbers are presented for both velocity waveforms over the range of frequencies considered, and the trends are discussed. A lumped-capacitance analysis for the chip is presented in terms of nondimensional parameters. The chip temperatures obtained from the analysis are compared to results obtained numerically.
Skip Nav Destination
Article navigation
September 2003
Technical Papers
Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena
Sreekant V. J. Narumanchi,
Sreekant V. J. Narumanchi
Department of Mechanical Engineering and Institute for Complex Engineered Systems, Carnegie Mellon University, Pittsburgh, PA 15213
Search for other works by this author on:
Cristina H. Amon, Fellow ASME,
Cristina H. Amon, Fellow ASME
Department of Mechanical Engineering and Institute for Complex Engineered Systems, Carnegie Mellon University, Pittsburgh, PA 15213
Search for other works by this author on:
Jayathi Y. Murthy, Mem. ASME
Jayathi Y. Murthy, Mem. ASME
School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
Search for other works by this author on:
Sreekant V. J. Narumanchi
Department of Mechanical Engineering and Institute for Complex Engineered Systems, Carnegie Mellon University, Pittsburgh, PA 15213
Cristina H. Amon, Fellow ASME
Department of Mechanical Engineering and Institute for Complex Engineered Systems, Carnegie Mellon University, Pittsburgh, PA 15213
Jayathi Y. Murthy, Mem. ASME
School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division February 6, 2001; revised manuscript received May 31, 2002. Associate Editor: R. Wirtz.
J. Electron. Packag. Sep 2003, 125(3): 354-361 (8 pages)
Published Online: September 17, 2003
Article history
Received:
February 6, 2001
Revised:
May 31, 2002
Online:
September 17, 2003
Citation
Narumanchi , S. V. J., Amon, C. H., and Murthy, J. Y. (September 17, 2003). "Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena ." ASME. J. Electron. Packag. September 2003; 125(3): 354–361. https://doi.org/10.1115/1.1572903
Download citation file:
Get Email Alerts
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Related Articles
Experimental and Numerical Cross-Over Jet Impingement in an Airfoil Trailing-Edge Cooling Channel
J. Turbomach (October,2011)
Free Jet Impingement Heat Transfer of a High Prandtl Number Fluid Under Conditions of Highly Varying Properties
J. Heat Transfer (August,1999)
Aerothermal Investigations of Mixing Flow Phenomena in Case of Radially Inclined Ejection Holes at the Leading Edge
J. Turbomach (April,2000)
Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
J. Electron. Packag (September,2007)
Related Proceedings Papers
Related Chapters
Introduction
Thermal Management of Microelectronic Equipment
Liquid Cooled Systems
Thermal Management of Telecommunication Equipment, Second Edition
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment