In this work, a simple assembled structure was designed and fabricated so that the calibration procedures on piezoresistive stress sensors for microelectronic packaging can be simpler, more accurate, and more efficient. After comparing with the previous work results, validity of the aforementioned new structure has been demonstrated through experimental data. Since many accessory experimental facilities employed in traditional calibrations become unnecessary, the new methodology takes great advantage on piezoresistive coefficient extractions, especially for calibration at temperature other than room temperature.
Calibrate Piezoresistive Stress Sensors Through the Assembled Structure
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division April 30, 2002. Associate Editor: K. Kishimoto.
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Lwo, B., and Wu, S. (June 10, 2003). "Calibrate Piezoresistive Stress Sensors Through the Assembled Structure ." ASME. J. Electron. Packag. June 2003; 125(2): 289–293. https://doi.org/10.1115/1.1572904
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