The role and the attributes of, and challenges in, the predictive modeling of the thermomechanical behavior of microelectronic and photonic structures (packages) are addressed. Merits, shortcomings and interaction of theoretical and experimental approaches are discussed, as well as the role and the interaction of the analytical (“mathematical”) and numerical (computer-aided) modeling. We briefly review the published work in the field, with an emphasis on the analytical modeling of the thermally induced stresses and displacements. The review is based, to a great extent, on the author’s research conducted during his eighteen years tenure with Bell Laboratories, Physical Sciences and Engineering Research Division, Murray Hill, New Jersey. The major message of the article is that a viable and reliable optoelectronic product can be successfully created and delivered to the market in a timely fashion only provided that predictive modeling, whether analytical or numerical, is widely and effectively used, in addition and, preferably, prior to experimental investigations and testing.
Skip Nav Destination
Article navigation
June 2003
Technical Papers
Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review
E. Suhir, Fellow ASME,
E. Suhir, Fellow ASME,
University of Illinois at Chicago, Chicago, IL
Search for other works by this author on:
E. Suhir, Fellow ASME,
University of Illinois at Chicago, Chicago, IL
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division June 22, 2001. Guest Editors: Y. Muzychka and R. Culham.
J. Electron. Packag. Jun 2003, 125(2): 261-267 (7 pages)
Published Online: June 10, 2003
Article history
Received:
June 22, 2001
Online:
June 10, 2003
Citation
Suhir, E. (June 10, 2003). "Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review ." ASME. J. Electron. Packag. June 2003; 125(2): 261–267. https://doi.org/10.1115/1.1569510
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Related Articles
Predictive Analytical Thermal Stress Modeling in Electronics and Photonics
Appl. Mech. Rev (July,2009)
Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
J. Electron. Packag (March,2009)
Measurement of Thermal Deformation of Interconnect Layers Using SIEM
J. Electron. Packag (September,2002)
On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
J. Electron. Packag (June,2008)
Related Proceedings Papers
Related Chapters
Subsection NB—Class 1 Components
Companion Guide to the ASME Boiler & Pressure Vessel Codes, Volume 1 Sixth Edition
Openings
Guidebook for the Design of ASME Section VIII Pressure Vessels
Piping Design
Power Boilers: A Guide to the Section I of the ASME Boiler and Pressure Vessel Code, Second Edition