A general solution, based on the separation of variables method for thermal spreading resistances of eccentric heat sources on a rectangular flux channel is presented. Solutions are obtained for both isotropic and compound flux channels. The general solution can also be used to model any number of discrete heat sources on a compound or isotropic flux channel using superposition. Several special cases involving single and multiple heat sources are presented.

Issue Section:
Technical Papers
Keywords:
thermal resistance, integrated circuit packaging, thermal management (packaging), Conduction, Electronics Cooling, Heat Spreaders, Heat Sinks, Spreading Resistance
Topics:
Heat, Temperature
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