This paper describes the tensile strength and inelastic constitutive relationship of six types of Sn-Pb solders. Static tension tests were carried using 5Sn-95Pb, 10Sn-90Pb, 40Sn-60Pb, 60Sn-40Pb, 63Sn-37Pb, and 62Sn-36Pb-2Ag solders at the strain rates of 0.001–10.0%/s between temperatures of 313 K and 398 K. Strain rates faster than 2.0%/s were needed to obtain the time-independent Young modulus and yield stress of the solders. Tensile strength increased with increasing strain rates up to 10%/s. Parametric equations for predicting tensile strength, Young’s modulus and yield stress of Sn-Pb solders were developed as a function of temperature and Sn content. Plastic and creep constitutive equations were also proposed as a function of temperature and Sn content. The stress amplitude predicted by these equations agreed with the experimental results within ±2 MPa.
Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, November 30, 2000; revised manuscript received March 18, 2002. Associate Editor: Y.-H. Pao.
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Nose, H., Sakane, M., Tsukada, Y., and Nishimura, H. (March 14, 2003). "Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders ." ASME. J. Electron. Packag. March 2003; 125(1): 59–66. https://doi.org/10.1115/1.1533058
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