A crack initiated from a V-notch corner in the molding resin, such as a corner of die pad, is one of the main causes of the failure in plastic packages. The stress intensity factors of the asymptotic solution of a corner of jointed dissimilar materials are utilized for the evaluation of a solder reflow crack in a quad flat package (QFP). First, we estimate the critical vapor pressure, which causes a crack from a corner in the molding resin, using the critical stress intensity factor of a V-notch corner. This critical factor was measured by V-notched three-point bending tests and the displacement extrapolation method along with the three dimensional (3-D) finite element method (FEM). Moisture concentration in the QFP after absorption is analyzed, and vapor pressure caused by the solder reflow process is estimated. The critical moisture absorption time, which results in crack occurrence during the solder reflow process, can be predicted using this evaluation technique. Furthermore, we perform infrared solder reflow tests of the QFP for verifying the present failure evaluation technique.
Skip Nav Destination
e-mail: ikeda@chem-eng.kyushu-u.ac.jp
Article navigation
March 2003
Technical Papers
Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch
Toru Ikeda,
Toru Ikeda
Department of Chemical Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581 Japan
Search for other works by this author on:
Isao Arase,
Isao Arase
Department of Chemical Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581 Japan
Search for other works by this author on:
Yuya Ueno,
Yuya Ueno
Department of Chemical Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581 Japan
Search for other works by this author on:
Noriyuki Miyazaki,
e-mail: ikeda@chem-eng.kyushu-u.ac.jp
Noriyuki Miyazaki
Department of Chemical Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581 Japan
Search for other works by this author on:
Nobutaka Ito,
Nobutaka Ito
Fujitsu Limited, Kawasaki, 211-8588 Japan
Search for other works by this author on:
Mami Nagatake,
Mami Nagatake
Fujitsu Limited, Kawasaki, 211-8588 Japan
Search for other works by this author on:
Mitsuru Sato
Mitsuru Sato
Fujitsu Limited, Kawasaki, 211-8588 Japan
Search for other works by this author on:
Toru Ikeda
Department of Chemical Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581 Japan
Isao Arase
Department of Chemical Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581 Japan
Yuya Ueno
Department of Chemical Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581 Japan
Noriyuki Miyazaki
Department of Chemical Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581 Japan
e-mail: ikeda@chem-eng.kyushu-u.ac.jp
Nobutaka Ito
Fujitsu Limited, Kawasaki, 211-8588 Japan
Mami Nagatake
Fujitsu Limited, Kawasaki, 211-8588 Japan
Mitsuru Sato
Fujitsu Limited, Kawasaki, 211-8588 Japan
Contributed by the Electronic and Photonic Packaging Division for publication in the Journal of Electronic Packaging. Manuscript received by the EPPD Division, April 21, 2001; revised manuscript received January 4, 2002. Associate Editor: B. Michel.
J. Electron. Packag. Mar 2003, 125(1): 31-38 (8 pages)
Published Online: March 14, 2003
Article history
Received:
April 21, 2001
Revised:
January 4, 2002
Online:
March 14, 2003
Citation
Ikeda , T., Arase , I., Ueno , Y., Miyazaki, N., Ito , N., Nagatake , M., and Sato, M. (March 14, 2003). "Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch ." ASME. J. Electron. Packag. March 2003; 125(1): 31–38. https://doi.org/10.1115/1.1525244
Download citation file:
Get Email Alerts
Cited By
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Related Articles
Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin
J. Electron. Packag (December,2002)
Hygrothermal Cracking Analysis of Plastic IC Package
J. Electron. Packag (June,2005)
The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging
J. Electron. Packag (June,2002)
Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages
J. Electron. Packag (December,2000)
Related Proceedings Papers
Related Chapters
FAILURE ANALYSIS OF A STRESS-BASED PIPELINE UNDER PLASTIC STRAIN
Pipeline Integrity Management Under Geohazard Conditions (PIMG)
Determining Fracture Directions and Fracture Origins on Failed Graphite/Epoxy Surfaces
Nondestructive Evaluation and Flaw Criticality for Composite Materials
Radial Delayed Hydride Cracking in Irradiated Zircaloy-2 Cladding: Advanced Characterization Techniques
Zirconium in the Nuclear Industry: 20th International Symposium