PBGA has the advantage of being compatible with existing surface-mount process. The eutectic solder balls collapse during reflow accommodates the lack of co-planarity, the surface tension between solder ball and associated pad creates a strong self-centering property to compensate for any placement offsets. However, some problems emerged in practice due to its special features. The major challenges for manufacturer are the inspection of solder joint and to perform touch-up. In most cases, the defect of solder joint cannot be found until in-circuit or functional testing is performed. At this stage, it becomes difficult to determine whether the defect is due to a solder joint or the component itself. Hence controlling the open defect is very important in the PBGA assembling process. It was found that three kinds of defective modes are responsible for the open defect; insufficient heating in the solder melting phase, poor thermal stability of PCB and PBGA and insufficient amount of printing solder paste. Based on the defect mechanism analysis, by optimizing the soldering process, very high assembly yield was achieved.
Skip Nav Destination
e-mail: shfan@ee.cityu.edu.hk
e-mail: eeycchan@cityu.edu.hk
Article navigation
March 2003
Technical Briefs
Open Defects in PBGA Assembly Solder Joints
S. H. Fan,
e-mail: shfan@ee.cityu.edu.hk
S. H. Fan
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong
Search for other works by this author on:
Y. C. Chan,
e-mail: eeycchan@cityu.edu.hk
Y. C. Chan
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong
Search for other works by this author on:
J. K. L. Lai
J. K. L. Lai
Department of Physics and Materials Science, City University of Hong Kong, Kowloon, Hong Kong
Search for other works by this author on:
S. H. Fan
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong
e-mail: shfan@ee.cityu.edu.hk
Y. C. Chan
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong
e-mail: eeycchan@cityu.edu.hk
J. K. L. Lai
Department of Physics and Materials Science, City University of Hong Kong, Kowloon, Hong Kong
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, March 19, 2002. Associate Editor: Y.-H. Pao.
J. Electron. Packag. Mar 2003, 125(1): 157-161 (5 pages)
Published Online: March 14, 2003
Article history
Received:
March 19, 2002
Online:
March 14, 2003
Citation
Fan , S. H., Chan , Y. C., and Lai , J. K. L. (March 14, 2003). "Open Defects in PBGA Assembly Solder Joints ." ASME. J. Electron. Packag. March 2003; 125(1): 157–161. https://doi.org/10.1115/1.1536951
Download citation file:
Get Email Alerts
Cited By
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Related Articles
Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation
J. Electron. Packag (September,2003)
Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies
J. Electron. Packag (December,2006)
Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver
J. Electron. Packag (September,1996)
Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices
J. Electron. Packag (March,2004)
Related Proceedings Papers
Related Chapters
Inspection and Maintenance of Ageing Concrete Oil and Gas Structures on the Norwegian Continental Shelf
Ageing and Life Extension of Offshore Facilities
Study on Thermal Stability of Swampy Slope Roadbed in Permafrost Regions of Qinghai-Tibet Railway
Geological Engineering: Proceedings of the 1 st International Conference (ICGE 2007)
Nuclear Fuel Materials and Basic Properties
Fundamentals of Nuclear Fuel