Thermal reliability of the solder sealing ring of Agilent Technologies’ bubble-actuated photonic cross-connect switches has been investigated in this paper. Emphasis is placed on the determination of the thermal-fatigue life of the solder sealing ring under shipping/storing/handling conditions. The solder ring is assumed to obey the Garofalo-Arrhenius creep constitutive law. The nonlinear responses such as the deflections, stresses, creep strains, and creep strain energy density of the 3-D photonic package have been determined with a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal-fatigue life of the solder sealing ring is readily determined and is found to be more than adequate for shipping/storing/handling the photonic switches.

Issue Section:
Additional Technical Papers
Keywords:
photonic switching systems, soldering, seals (stoppers), thermal analysis, materials handling, creep, stress analysis, finite element analysis, fatigue testing, tin alloys, indium alloys, thermal stress cracking, packaging
Topics:
Creep, Fatigue, Fatigue testing, Sealing (Process), Solders, Stress, Switches, Density, Cycles, Finite element analysis, Silicon chips, Molybdenum, Deflection
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Copyright © 2002
 by ASME
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