An analytical model relating the degree of cure of an underfill epoxy to the heat transfer coefficient of the heating process and time is presented. The model was verified experimentally by partially curing samples of a commercial underfill epoxy in two different heating environments for various times and scanning the samples in a differential scanning calorimeter to determine the degree of cure. A simplified equation can be used to relate the time required to achieve a given degree of cure to the heat transfer coefficient and the isothermal cure time.
An Analytical Cure Model for Underfill Epoxies
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, April 2001; revised manuscript received April 20, 2002. Associate Editor: A. Tay.
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Mahajan, R. L., Malhotra , C. P., and Sharma, R. K. (December 12, 2002). "An Analytical Cure Model for Underfill Epoxies ." ASME. J. Electron. Packag. December 2002; 124(4): 391–396. https://doi.org/10.1115/1.1510864
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