Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from the intermetallics. As a result, it was shown that the long cast time yielded the intermetallics and microstructures of the solder invariable regardless of aging condition. The granular micro-structure of the air-cooled specimens was shown to be inferior to the laminated micro-structure of the furnace-cooled specimens. Also, transition of fatigue crack behavior with and the procedure of fatigue crack propagation from the pre-crack tip were discussed.
Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division October 12, 2001. Associate Editor: Y.-H. Pao.
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Kang , K., Choi, S., and Bae, T. (December 12, 2002). "Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints ." ASME. J. Electron. Packag. December 2002; 124(4): 385–390. https://doi.org/10.1115/1.1510863
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