Thermo-mechanical reliability in advanced electronic packaging requires new materials testing approaches. The necessary understanding of the impact of very local material stressing on component reliability leads to the need of materials testing and characterization on microscopic scale. For example, defect initiation and propagation in multilayer structures as in WLP and flip chip technology, the influence of material migration to mechanical behavior or defect development in ultra-thin silicon dies often are not well understood. A key for micro materials testing and characterization is the measurement of strains and displacements inside microscopic regions. Correlation techniques (e.g., microDAC, nanoDAC) are one of the promising tools for that purpose. Their application potentials to micro testing for electronic packaging materials are demonstrated in the paper. More in detail, CTE measurement and crack testing are discussed. First attempts for testing under AFM conditions and their results are considered.

Issue Section:
Technical Papers
Keywords:
integrated circuit packaging, strain measurement, deformation, thermal expansion measurement, displacement measurement, atomic force microscopy, integrated circuit reliability, nondestructive testing, correlation methods, flip-chip devices, image processing, crack detection
Topics:
Atomic force microscopy, Deformation, Displacement, Displacement measurement, Flip-chip devices, Fracture (Materials), Materials properties, Packaging, Reliability, Stress, Temperature, Testing, Thermal expansion, Algorithms, Anisotropy, Computer software, Strain measurement, Thermomechanics, Materials testing, Electronic packaging
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Copyright © 2002
 by ASME
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